With over 30 years of experience in power electronics integration, celduc® is now expanding its expertise by offering customized design and manufacturing services (ODM – Original Design Manufacturer) for power modules. With state-of-the-art industrial facilities, 100% French production, and comprehensive prototyping, industrialization, and qualification capabilities, celduc® is positioned as a leading technology partner in the field of power semiconductors.
We work closely with your engineering teams to deliver boards that are manufactured, tested, and ready to be integrated into your industrial solutions.

celduc® has mastered the integration of the main semiconductor technologies currently used in the power industry:
These different technologies enable celduc® to address a wide range of applications—from electromobility to renewable energies and industrial automation.

celduc® has a fully automated production line equipped with state-of-the-art machinery. This automation ensures perfect reproducibility of assemblies, consistent quality across volumes, and flexibility for both prototype and industrial series manufacturing.
All of the equipment, installed in France, reflects celduc®’s commitment to maintaining local, efficient, and sustainable production.
The performance of a power module depends not only on the choice of semiconductors, but also on the quality of the substrate and the assembly process. celduc® uses several integration processes recognized for their reliability:
• IMS (Insulated Metal Substrate): technology promoting excellent heat dissipation and high mechanical robustness, ideal for applications requiring high power density.
• COB (Chips On Board): direct integration of chips onto the board to minimize parasitic inductance and improve electrical performance.
• DCB (Direct Copper Bonded): copper-bonded ceramic substrate ensuring excellent electrical insulation and optimal thermal conduction for high-power modules.
These processes are carried out in a highly controlled environment, with complete traceability of production batches and components.

Using automated optical inspection (AOI), we guarantee high-precision control of the positioning and bonding wire integrity, while automatically detecting contamination, component defects, and critical anomalies.
Our advanced failure analysis capabilities enable us to identify unknown particles and study material-substrate interactions, ensuring quality, traceability, and reliability in line with Industry 4.0 standards.

Thanks to this unique combination of integration technologies, advanced processes, and recognized industrial expertise, celduc® supports its customers throughout the entire product life cycle—from initial design to mass production.
Whether for specific development or co-design based on specifications, celduc® positions itself as a strategic partner in the field of next-generation power modules.
We don’t just design and manufacture your innovative solutions: we support your projects with high-performance testing and validation services:
Your designs are validated under real-world conditions, ready to be integrated into your systems with optimal reliability, performance, and quality.
celduc®’s custom-made power electronics solutions are designed for a wide range of applications, from electromobility and renewable energy to industrial automation.
